Features
- Form: Paste
- High Conductivity (<3.0 mohm/sq @ 12 μm Fired Film Thickness)
- Fine Line Printing
- Firing Temperature : 850 °C (10 min)
- Excellent Adhesion on Alumina, Silicon Substrates
- Pb, Cd, Ni Free
- Excellent Solderability
- Viscosity : 800 Kcps (@ 25 °C and 0.1 1/s)
- Screen Printing, Stencil Printing, Direct Ink Writing
- Characterizations: SEM of the purchase
